Experimental Investigation on Influence of Black Gram, Copper Slag and E-Waste in Concrete

Abstract

A growing problem that seriously pollutes both the environment and people is electronic trash. Due to the lack of coarse aggregate needed to prepare concrete, an attempt was made to replace some of the E-waste with coarse aggregate. We will replace 15% of the coarse aggregate with E-waste to achieve the highest compressive strength possible. The next component of concrete is cement, which is made from black gram pulse. Concrete was blended with black gram, a binder used in mortar and plaster in ancient India. In place of 10 grams of cement, 0.2 grams of black gram powder are used. One of the materials that may be regarded as waste is copper slag, which has a bright future in the building sector as a partial or whole alternative for fine aggregate. Here, we intend to replace around 40% of the copper slag in the fine aggregate. Copper slag is a by-product obtained during matte smelting and refining of copper. The common management options for copper slag are recycling, recovering of metal, production of value added products such as abrasive tools, roofing granules, cutting tools, abrasive, tiles, glass, road-base construction, railroad ballast, asphalt pavements. Despite increasing rate of reusing copper slag, the huge amount of its annual production is disposed in dumps or stockpiles to date. One of the greatest potential applications for reusing copper slag is in cement and concrete production. Many researchers have investigated the use of copper slag in the production of cement, mortar and concrete as raw materials for clinker, cement replacement, coarse and fine aggregates. The use of copper slag in cement and concrete provides potential environmental as well as economic benefits for all related industries, particularly in areas where a considerable amount of copper slag is produced. This paper reviews the characteristics of copper slag and its effects on the engineering properties of cement, mortars and concrete.