Miniaturization of Substrate Integrated Waveguide based Antennas for Microwave Communications

Authors

  • M. Ravi Kishore
  • Dr. K.C.B. Rao

Keywords:

Substrate integrated waveguide, Miniaturization, Equilateral triangular antenna, Metallic vias,Coaxial-Fed, HFSS software

Abstract

Substrate Integrated Waveguide (SIW) technology is the most emerging technology for the
implementation of effective radiating systems for the future wireless systems. It is a synthetic
rectangular electromagnetic waveguide which is formed in a dielectric substrate by densely
arraying metalized posts or via-holes which connect the upper and lower metal plates to form
a radiating system. SIW antennas are used in many applications in the field of
communication systems due to several advantages such as light weight, low production cost,
low profile, reproducibility, reliability, and integration with solid state devices. This paper
presents the methods of miniaturization of equilateral triangular micro strip antenna based
on SIW technology. The performance of the proposed antennas is observed by doing some
significant changes to the construction of the patch, substrate and ground with specified
dimensions. The coaxial feeding at a specified location is used to achieve better impedance
matching and Arlon AD270 substrate having dielectric constant 2.7 with optimum values of
substrate heights are used. The miniaturization and performance of the antennas are
compared in terms of Return losses, VSWR, radiation pattern and gain. The proposed
antennas are designed and simulated using Finite element method based HFSS (High
Frequency Structure Simulator) version software.

Published

2019-04-06

Issue

Section

Articles