Formulation and characterization of high thermal conductivity copper nanofluids for a single step industrial heat transfer application system for microelectronics and automobiles

Abstract

This research article investigate a novel method for the formulation of stable, non–
agglomerated copper nanofluids by reducing copper sulphate pentahydrate with sodium
hypophosphite chemical as a reducing agent in ethylene glycol as base power fluid by means
of conventional heat transfer process in electronics, electrical and automobiles. This is an
insitu, single step method, which gives very high yield of product with less time duration. The
characterization of the nanofluid was done by particle size analyzer, x-ray diffraction (XRD),
uv-visible (UV-VIS) analysis and Fourier transform infrared spectroscopy (FTIR) followed
by thermal conductivity studies of nanofluid by the well known transient hot wire anemometer
method.