SAROJ SHARMA. Thermosyphon Heat Sink Integrated Framework for CPU Cooling. Journal of Power Electronics and Devices, [S. l.], v. 1, n. 1, p. 19–25, 2016. Disponível em: https://matjournals.co.in/index.php/JOPED/article/view/6516. Acesso em: 29 may. 2026.